- Load-lock system (Max. 5 inch wafer loading available) - Manual sample loading from load-lock to main chamber - 2 DC, 1 RF plasma source - 3 sputtering gun (Downward deposition, uniform co-deposition available) - 3 gas line (Ar, O2, N2) - Substrate Heater - Turbomolecular pump - Maker : DAEKI Hi-tech for metal, metal-oxide layer deposition